DOW D.E.R. (R) 331 EPOXY RESIN
D.E.R.(R) 332
CAS: 25085-99-8
Molecular Formula: C21H24O4
DOW D.E.R. (R) 331 EPOXY RESIN - Names and Identifiers
| Name | D.E.R.(R) 332 |
| Synonyms | araldite B ARALDITEMY790 D.E.R.(R) 332 Bisphenol Apoxyresin-03 DOW D.E.R. (R) 331 EPOXY RESIN bisphenol A diglycidyl ether polymer BISPHENOLADIGLYCIDYLETHERHOMOPOLYMER oxirane,2,2'-[(1-methylethylidene)bis(4,1-phenyleneoxymethylene)]bis-, Oxirane,2,2'-[(1-methylethylidene)bis(4,1-phenyleneoxymethylene)]bis-,homopolymer |
| CAS | 25085-99-8 |
| EINECS | 942-372-5 |
DOW D.E.R. (R) 331 EPOXY RESIN - Physico-chemical Properties
| Molecular Formula | C21H24O4 |
| Molar Mass | 340.42 |
| Density | 1.16 g/cm3(Temp: 25 °C) |
| Melting Point | 45-55 °C |
| Water Solubility | Soluble in 100% ethanol, dimethyl sulfoxide (100 mM), dimethyl formamide, chloroform, methanol, and ethanol (50 mM). Insoluble in water. |
DOW D.E.R. (R) 331 EPOXY RESIN - Risk and Safety
| Risk Codes | 43 - May cause sensitization by skin contact |
| Safety Description | 36 - Wear suitable protective clothing. |
| WGK Germany | 3 |
DOW D.E.R. (R) 331 EPOXY RESIN - Introduction
D.E.R.(R) 332 is a commonly used epoxy resin. It has the following properties:
1. physical properties: bisphenol A epoxy resin has good chemical stability and heat resistance, can withstand high temperature and chemical corrosion.
2. mechanical properties: high strength and stiffness, good impact resistance.
3. Insulation performance: It has excellent insulation performance and can be used for the packaging of electronic components and the preparation of insulating materials.
4. Adhesive properties: bisphenol A epoxy resin has good adhesive properties, can be used for bonding metal, ceramic, plastic and other materials.
The main uses of bisphenol A epoxy resin include:
1. plastic products: can be used in the manufacture of industrial parts, electronic components, plastic film, etc.
2. adhesive: can be used for bonding metal, ceramic, plastic and other materials.
3. anticorrosive coatings: can be used for the preparation of anticorrosive coatings.
4. electronic materials: can be used for electronic packaging, circuit board preparation.
The bisphenol A type epoxy resin is usually produced by reacting bisphenol A with a crosslinking agent (for example, an amine compound) for an epoxy resin.
Regarding the safety information of bisphenol A epoxy resin, the following points should be noted:
1. Bisphenol A is considered a hazardous substance and may be toxic to biological systems.
2. During use, avoid contact with skin and inhalation of particles or gases.
3. During the heating and curing process of bisphenol A epoxy resin, harmful volatiles will be released, so it should be operated in a well-ventilated environment.
4. When disposing of waste, it should be disposed of in accordance with local regulations to avoid pollution to the environment.
Generally speaking, bisphenol A epoxy resin is an important engineering material, which should be used under appropriate conditions and pay attention to safety issues. In the use and handling process should follow the relevant safety practices.
Last Update：2024-04-17 15:03:54
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View History
DOW D.E.R. (R) 331 EPOXY RESIN
4-甲基苯亚甲基樟脑
17Α-羟基-21-碘黄体酮
7-羟基-6,4'-二甲氧基异黄酮
CUPRICCHROMITE
alpha-[[(1,1-二甲基乙氧基)羰基]氨基]-2-氟-苯乙酸
CITRONELLYL-3-METHYLBUT-2-ENOATE
PHENETHYLTRIS(TRIMETHYLSILOXY)SILANE, VISCOSITY 4 CST. AT 25C
N-叔丁氧羰基-N'-苄氧羰基-L-2,3-二氨基丙酸二环己胺盐
2-氨基-3,5-二碘苯甲酸,
4-甲基苯亚甲基樟脑
17Α-羟基-21-碘黄体酮
7-羟基-6,4'-二甲氧基异黄酮
CUPRICCHROMITE
alpha-[[(1,1-二甲基乙氧基)羰基]氨基]-2-氟-苯乙酸
CITRONELLYL-3-METHYLBUT-2-ENOATE
PHENETHYLTRIS(TRIMETHYLSILOXY)SILANE, VISCOSITY 4 CST. AT 25C
N-叔丁氧羰基-N'-苄氧羰基-L-2,3-二氨基丙酸二环己胺盐
2-氨基-3,5-二碘苯甲酸,